StratEdge Revolutionizes Semiconductor Packaging with Advanced Ceramic Solutions
Slice of Manufacturing Team
08/16/2024
Key Highlights:
- Innovative molded and post-fired ceramic packages engineered for high-reliability.
- Optimized for high-frequency applications up to 63+ GHz, perfect for GaN, GaAs, and SiC semiconductors.
- ISO 9001:2015 certified facility with state-of-the-art microelectronic assembly equipment.
Source (Business Wire)
Quotes
“ "Working with compound semiconductors, such as GaN, requires a package that can best dissipate the heat from the device while ensuring optimal performance. We manufacture our high-frequency packages with precision, using post-fired ceramics with laser-cut features to control tight tolerances." ”
Casey Krawiec, VP of Global Sales at StratEdge
Our Take:
StratEdge Corporation is setting a new benchmark in semiconductor packaging by addressing the critical needs of modern high-frequency applications. Their focus on precision engineering and thermal management, particularly with GaN and other compound semiconductors, demonstrates their commitment to advancing the industry's capabilities. Their state-of-the-art facility and rigorous adherence to quality standards ensure that StratEdge remains a trusted partner in sectors where performance and reliability are paramount. As industries demand more from semiconductor technologies, StratEdge’s innovative solutions offer a crucial competitive edge.
